Connect Wi-ME - Sicheres 802.11b Wi-Fi System-on-Module

Das Connect Wi-ME von Digi ist ein System-on-Module.
Das Connect Wi-ME von Digi ist ein System-on-Module.
Das System-on-Module Digi Connect® Wi-ME ist ausgestattet mit einem seriellen RJ-45 Anschluss, Wi-Fi inklusive Antenne und Device Cloud Unterstützung.

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Digi Connect® Wi-ME - Integrated Secure 802.11b Wi-Fi WLAN Support

The Digi Connect Wi-ME is a fully customizable, future-proof and secure 802.11b wireless embedded system-on-module (SoM) with Wi-Fi WLAN support. Built on leading 32-bit NET+ARM technology, the connector-style module is pin-compatible with the wired Digi Connect ME®, and makes fully transparent 802.11b integration possible without the traditional complexities of hardware and software integration work. The wireless embedded module offers true long-term product availability and state-of-the-art wired and wireless security capabilities such as SSL/TLS and WPA2/802.11i.

The Digi Connect ME family features the development and operational benefits of Digi Device Cloud. This secure, highly-scalable platform seamlessly ties enterprise applications and remote devices together.

Device Cloud empowers IT, network operations and customer support organizations to conquer the challenges of managing equipment in their device networks. Network managers can remotely configure, upgrade, monitor and troubleshoot remote devices, and create applications that improve productivity, speed and efficiency.

Modules with pre-loaded Digi plug-and-play firmware eliminate software development efforts by providing powerful and configurable IPv4/IPv6 device server functionality, including an easy-to-use web user interface and security features. The system-on-module also offers an industrial operating temperature. Target applications include retail systems, security/access control, medical devices and building/industrial automation.

For custom embedded applications, the IPv6-ready and royalty-free NET+OS® development kits based on the field-proven ThreadX® RTOS offer a complete professional embedded software platform with all integrated building blocks required to create secure network-enabled product designs.

Processor Type32-bit Digi NS7520 processor
Processor Speed55 MHz
Memory Base Population8 MB SDRAM
Pins/Form FactorRJ-45 connector style with 20-pin micro pin header (Samtec FTS-110-01-F-DV-TR)
High-Speed TTL Serial InterfaceUp to 230 Kbps data rate Full signal support for TXD, RXD, RTS, CTS, DTR, DSR and DCD Hardware/Software flow control
GPIOUp to 10 shared with 1 external IRQ
On-module Power Supervisor
JTAG InterfaceNET+OS development modules only (P/N DC-ME-01T-JT, DC-ME4-01T-JT)
Wave-Solderable DesignNo clean flux process
Storage Temperature-50° C to +125° C (-58° F to +257° F)
Relative Humidity5% to 90% (non-condensing)
Altitude12,000 feet (3,658 meters)
Regulatory ApprovalsFCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2 and EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Sub C Section 15.247, IC RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, UL 60950-1, EN 60950 (EU), CSA C22.2, No. 60950, EN 55024,
Digi Connect Wi-ME
Memory Base Population4 MB NOR flash
Dimensions (L x W x H)1.845 in (46.86 mm) x 0.75 in (19.05 mm) x 0.854 in (21.69 mm)
StandardIEEE 802.11b
Frequency2.4 GHz
Data RateUp to 11 Mbps with automatic fallback
ModulationCCK (11/5.5 Mbps), DQPSK (2 Mbps), DBPSK (1 Mbps)
Typical Transmit Power16 dBm typical
Receive Sensitivity-66 dBm @ 11 Mbps
Connector1 x RP-SMA
WEP (Wired Equivalent Privacy)64/128-bit encryption (RC4)
WPA/WPA2/802.11i128-bit TKIP/CCMP (AES) encryption Enterprise mode (802.1X): LEAP (WEP only), PEAP, TTLS, TLS; EAP-FAST, GTC, MD5, OTP, PAP, CHAP, MSCHAP, MSCHAPv2, TTLS-MSCHAPv2 Pre-shared key mode (PSK/Personal)
Operating Temperature-30° C to +75° C (-22° F to +167° F)
Maximum400 mA (1.32 W)
Modules with Plug-and-Play Firmware
Digi Connect Wi-ME DC-WME-01T-S
Modules for NET+OS
Digi Connect Wi-ME DC-WME-01T-C